Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions
US7611982B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2004 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Aug 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.