Visually inspectable surface mount device pad
US7612296B2 · kind B2 · utility
5Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2005 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Aug 31, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.