Inter-chip communication
US7612443B1 · kind B1 · utility
46Cited by
103References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2004 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Nov 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.