Structures to enhance cooling of computer memory modules

US7612446B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Hien Dang · Nanuet, US
• Vinod Kamath · Raleigh, US
• Vijayeshwar D. Khanna · Ossining, US
• Gerard McVicker · Wappingers Falls, US
• Sri M. Sri-Jayantha · Ossining, US
• Jung Hyuk YOON · Icheon-si, KR

Key dates

• Filing date: Nov 22, 2006
• Grant date: Nov 3, 2009
• Expiry date: Apr 7, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.