Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types
US7613368B2 · kind B2 · utility
9Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Aug 15, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/43
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.