Ink composition for etching resist, method of forming etching resist pattern using the same, and method of forming microchannel using the ink composition
US7615334B2 · kind B2 · utility
3Cited by
7References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 16, 2005 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Jul 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0786
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Provided are an ink composition for an etching resist, a method of forming an etching resist pattern using the ink composition, and a method of forming a microchannel using the ink composition. The ink composition is suitable for forming a micro pattern due to its poor spreading on the substrate and is suitable for etching-resist for copper of a printed circuit board and deep etching a stainless steel substrate due to its excellent chemical properties that allow it to resist an etching solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.