Method for containing a device and a corresponding device
US7615395B2 · kind B2 · utility
12Cited by
8References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 26, 2006 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Jun 26, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An electrical connection is provided between the base layers and the one or more metallization layers formed above the micromechanical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.