Methods of manufacturing semiconductor devices and semiconductor devices manufactured using such a method
US7615817B2 · kind B2 · utility
8Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2007 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Feb 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
Abstract
A method of manufacturing a semiconductor device includes forming a pillar-shaped active region by etching a portion of a semiconductor substrate, forming a blocking film selectively exposing a sidewall of a lower portion of the pillar-shaped active region, and forming a bit-line selectively on the exposed sidewall of the lower portion of the pillar-shaped active region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.