Temperature measurement and heat-treating methods and systems
US7616872B2 · kind B2 · utility
29Cited by
226References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2005 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Jan 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Temperature measurement and heat-treating methods and systems. One method includes identifying a temperature of a first surface of a workpiece, and controlling energy of an irradiance flash incident on the first surface of the workpiece, in response to the temperature of the first surface. Identifying may include identifying the temperature of the first surface during an initial portion of the irradiance flash, and controlling may include controlling the power of a remaining portion of the irradiance flash. The first surface of the workpiece may include a device side of a semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.