Sensor packaging method for a human contact interface
US7617599B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2007 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | May 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods of packaging systems pressure-sensitive devices that are subject to human contact force are disclosed. The methods include coupling and attaching the sensing devices and at least one other integrated circuit to a substrate; applying and curing a relatively-soft, protective material over the sensing portion of the sensing device; positioning a covering tool over the cured material; applying and curing a relatively-hard, protective coating around the covering tool and the relatively-soft, protective material; and applying a second, relatively-soft, protective material in the void left by the withdrawn covering tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.