Patent · US Active

Method for printing an electronic circuit component on a substrate using a printing machine

US7617774B2 · kind B2 · utility

1Cited by

9References

7Claims

0Family size

Assignee

The Maitland Company, LLC · DE

Inventors

Thomas Walther · Ramonville-Saint-Agne, FR
Reinhard Baumann · Krailing, DE
Peer Dilling · Stätzling, DE
Robert Weiss · Gersthofen, DE

Key dates

Filing date	Apr 29, 2005
Grant date	Nov 17, 2009
Priority date	—
Expiry date	Aug 22, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1581
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of printing an electronic circuit or components thereof uses a printing machine to print a conductive structure on the front printing side (back side of the sheet) of a printing substrate. The sheet is then reversed and a decorative printing motif is printed on the back side in one work step. Alternatively, the circuit or components of a circuit may be printed by having a printing machine for color printing preceded by a printing machine for printing on the back side of the printing substrate. A chip is applied to the printing substrate where the back side of the printing sheet with the printing motif is cooled to prevent any negative effect on the printing motif and/or the printing substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.