Solder compositions; method of soldering, and a laminated transparency having bus bars
US7617964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2006 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Jan 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/016
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A low temperature solder including indium in the range of 62-65 weight percent and tin in the range of 31-33 weight percent uses the heat generated during thermal treatment of one or more glass sheets to melt the solder. In one non-limiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.