Memory card molding apparatus and process
US7618249B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2006 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Oct 23, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/27
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding system for provided which is configured for molding a substrate comprising a plurality of individual carriers each of which is pre-cut into a shape of a memory card device and connected to a frame of the substrate by narrow tie bars. A molding plate is configured to receive the substrate, and a cavity plate configured to be clamped to the molding plate further comprises a plurality of molding cavities each constructed in the shape of the said carriers. The cavities are operative to create molded packages onto the carrier conforming to a shape of the memory card device without need for further forming of the molded compound after molding. Additionally, a nozzle on the surface of each cavity is operative to introduce molding material into the cavity in a direction that is substantially perpendicular to a plane of the substrate placed on the molding plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.