Microfabricated ultrasonic transducer array for 3-D imaging and method of operating the same
US7618373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2004 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Oct 2, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S15/8993
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A capacitive microfabricated transducer array used for 3-D imaging, with a relatively large elevation dimension and a bias control of the elevation aperture in space and time, confers the same benefits of mechanical translation, except that image cross-sections are electronically rather than mechanically scanned, and are registered very accurately in space. The 3-D cMUT, when combined with elevation bias control and convex curvature in elevation, increases the volume interrogated by the electronic scanning, thus improving field of view. Further still, the 3-D cMUT can be combined Fresnel focusing of the elevation section to improve the elevation focus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.