Metal powder for electrically conductive paste and electrically conductive paste
US7618475B2 · kind B2 · utility
6Cited by
6References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Jun 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metal powder for a conductive paste has an average particle diameter D50 not greater than 5 μm and an X value defined by equation (1) not greater than 0.5:X value=D50 (μm)/BET specific surface area (m2/g) (1)The metal powder for a conductive paste is particularly preferable when wart-like projections of a diameter not greater than 150 nm are present on the particle surfaces. Typical types of the metal powder include Cu, Ag, Au, Pd, Pt, Ni, Al and alloys thereof. The metal powder for a conductive paste enables fabrication of a conductor having a low void ratio after the paste is fired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.