Imprinting polymer film on patterned substrate
US7618510B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | May 20, 2004 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Apr 10, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/0046
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of applying a pattern on a topography includes first applying a polymer film to an elastomer member, such as PDMS, to form a pad. The pad is then applied to a substrate having a varying topography under pressure. The polymer film is transferred to the substrate due to the plastic deformation of the polymer film under pressure compared to the elastic deformation of the PDMS member. Thus, upon removal of the pad from the substrate, the PDMS member pulls away from the polymer layer, thereby depositing the polymer layer upon the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.