Method and apparatus for sequential plasma treatment
US7618686B2 · kind B2 · utility
72Cited by
16References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 24, 2002 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Apr 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for plasma treatment of a non-conductive hollow substrate, including a plurality of ionization energy sources disposed adjacent to each other all along the part of the substrate to be treated. The apparatus also includes a processor to sequentially power the plurality of ionization energy sources from a radio frequency power source. Each ionization energy source includes two parts sandwiching the substrate. The ionization energy sources can be capacitively or inductively coupled plasma sources.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.