Cellulosic/polyamide composite
US7618702B2 · kind B2 · utility
14Cited by
13References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2006 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Nov 24, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249949
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Composite of polyamide layer solvent bonded to cellulosic substrate is formed by solution electrospinning deposit of polyamide on cellulosic substrate with the solution subjected to electrospinning containing as solvent for polyamide one that swells cellulosic fibers on contact therewith and/or by depositing very long polyamide fibers of low average diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.