Camera module, manufacturing method of camera module, electronic apparatus, and manufacturing method of electronic apparatus
US7619684B2 · kind B2 · utility
7Cited by
6References
24Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 6, 2004 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Sep 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.