Heat dissipation module
US7619890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Apr 29, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation module includes a heat dissipation device, a resilient bracket and a cylindrically shaped nut. The heat dissipation device is attached to a heat generating component. The cylindrically shaped nut has an arc surface and two circular surfaces. A screw hole is formed on one of the two circular surfaces and an engraved slot is formed on the arc surface. The resilient bracket is secured to the heat dissipation device at an end and has a U-shaped cutout at an opposite end, wherein the U-shaped cutout has a constricted opening for receiving the cylindrically shaped nut. The U-shaped cutout engages with the engraved slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.