Heat spreader for electronic modules
US7619893B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 16, 2007 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Aug 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader is provided for use with an electronic module. The electronic module has a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat spreader includes a first segment mountable on the module to be in thermal communication with at least one electronic component mounted on the first side, and to be substantially thermally isolated from at least one electronic component mounted on the first side. The heat spreader further includes a second segment mountable on the module to be in thermal communication with the at least one electronic component mounted on the first side that is substantially thermally isolated from the first segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.