Conductive adhesives and biomedical articles including same
US7620439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2005 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Dec 10, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/302
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A conductive adhesive composition is provided and articles that include the adhesive composition as a component thereof. The conductive adhesive composition comprises: (a) pressure sensitive adhesive; (b) electrolyte comprising water soluble or water dispersible organic chloride; and (c) humectant. In some embodiments, the conductive adhesive composition is a bicontinuous composition comprising an aqueous phase and an oil phase, and the bicontinuous composition may be derived from a polymerizable microemulsion composition, the microemulsion composition comprising: an aqueous phase comprising one or more hydrophilic monomers or oligomers and/or one or more amphiphilic monomers or oligomers in water, the water-soluble or water-dispersible organic chloride, surfactant and humectant; and an oil phase comprising one or more hydrophobic monomers or oligomers. Biomedical articles such as biomedical electrodes, may incorporate the foregoing adhesive as a component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.