Method for optimized dematching layer assembly in an ultrasound transducer
US7621028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2007 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Sep 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49005
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A method for manufacturing an acoustical stack for use within an ultrasound transducer comprises using a user defined center operating frequency of an ultrasound transducer that is at least about 2.9 MHz. A piezoelectric material and a dematching material are joined with an assembly material to form an acoustical connection therebetween. The piezoelectric material has a first acoustical impedance and *at least one of* an associated piezoelectric rugosity (Ra) and piezoelectric waviness (Wa). The dematching material has a second acoustical impedance that is different than the first acoustical impedance and at least one of an associated dematching Ra and dematching Wa. The piezoelectric and dematching materials have an impedance ratio of at least 2. The assembly material has a thickness that is based on the center operating frequency and at least one of the piezoelectric Ra, piezoelectric Wa, dematching Ra and dematching Wa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.