Method of encapsulating an organic light-emitting device
US7621794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2005 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Nov 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
Abstract
A method of encapsulating an organic light-emitting device is disclosed, wherein the device includes a light-emitting portion and an electrical contact portion, the method including forming a polymer layer over the light-emitting portion and the electrical contact portion of the device; forming a separation in the polymer layer between a portion of the polymer layer disposed over the light-emitting portion of the device and a portion of the polymer layer disposed over the electrical contact portion of the device; adhering a film removal structure to the portion of the polymer layer disposed over the electrical contact portion of the device; and removing the film removal structure, thereby causing the removal of the portion of the polymer layer disposed over the electrical contact portion of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.