Pressure sensors and methods of making the same
US7622782B2 · kind B2 · utility
50Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2005 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Dec 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/909
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor includes a base substrate silicon fusion bonded to a cap substrate with a chamber disposed between the base substrate and the cap substrate. Each of the base substrate and the cap substrate include silicon. The base substrate includes walls defining a cavity and a diaphragm portion positioned over the cavity, wherein the cavity is open to an environment to be sensed. The chamber is hermetically sealed from the environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.