Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
US7622805B2 · kind B2 · utility
7Cited by
10References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Mar 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Multiple semiconductor device components and passive device components fixed to a substrate are embedded within an electroconductive-film/insulating-resin-film structure, and are thermally bonded to an insulating resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.