Transducer assembly with z-axis interconnect
US7622848B2 · kind B2 · utility
66Cited by
17References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Sep 7, 2027 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B8/445
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A composite structure of a z-axis interconnect is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged between a plurality of interconnect layers, where the plurality of interconnect layers is configured to facilitate coupling the composite structure of the z-axis interconnect to a transducer array, where the composite structure of z-axis interconnect is configured for use in an invasive probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.