Probe card assembly with a mechanically decoupled wiring substrate
US7622935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | May 24, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.