Methods and apparatuses for improved stabilization in a probing system
US7622939B2 · kind B2 · utility
2Cited by
13References
25Claims
0Family size
Inventors
Key dates
| Filing date | Oct 18, 2007 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Oct 18, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Improved methods and apparatuses for automatically and accurately maintaining the alignment of a wafer prober to the bonding pads of a semiconductor device in the presence of motion disturbances are provided. In one embodiment of one aspect of the invention, a feedback control system incorporating information from a number of acceleration and/or velocity sensors is used to maintain the desired contact position in the presence of motion disturbances. Other aspects and other embodiments are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.