High-speed RFID circuit placement method and device
US7623034B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2005 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Oct 29, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49137
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.