High-impedance substrate, antenna device and mobile radio device
US7623087B2 · kind B2 · utility
2Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2007 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Dec 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q15/008
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.