Patent · US Active

Automated product profiling apparatus and product slicing system using same

US7623249B2 · kind B2 · utility

33Cited by
39References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 7, 2008
Grant dateNov 24, 2009
Priority date
Expiry dateNov 7, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/531
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A system, suitable for high-speed operation, by which raw product (45), such as a slab of meat, can be accurately processed, such as by slicing into segments of desired weight, comprises a product profiling apparatus (15). The product profiling apparatus (15) measures the profile of the physical process. The product profiling apparatus (15) includes line lasers (75, 85) for directing a line of light across the upper and lower surfaces of the product (45) and visual image cameras (80, 90) directed toward the profile surface to capture, at fixed increments, the product profile. The product may also be weighed and the product density determined from the overall profile measurements. A controller (150) receives this data, and instructs the physical process accordingly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.