Thermal conducting medium protector
US7623350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2007 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Jun 4, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44556
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.