EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7623360B2 · kind B2 · utility
27Cited by
94References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Jun 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0032
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to various aspects of the present disclosure, exemplary embodiments are of assemblies capable of providing board level EMI shielding and heat dissipation of one or more electrical components. Other aspects relate to components of such assemblies. Further aspects relate to methods of using EMI shielding and thermal management assemblies. Additional aspects relate to methods of making EMI shielding and thermal management assemblies, and methods of making the components thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.