Direct-manufactured duct interconnects
US7623940B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Oct 16, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.