Calibration apparatus for bondhead of wire bonding machine
US7624904B1 · kind B1 · utility
4Cited by
5References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2008 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Sep 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wire bonding machine including a bondhead assembly having a transducer and a bonding tool is provided. The bondhead assembly is configured for substantially vertical movement with respect to a bonding surface of the wire bonding machine during a wire bonding operation. The wire bonding machine further includes a camera configured to receive images of a portion of the bondhead assembly, the images being used to determine a position where a length of the transducer is substantially parallel to the bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.