Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
US7625262B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Mar 18, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/46
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.