Hygroscopic molding
US7625638B2 · kind B2 · utility
6Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2003 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Aug 19, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/258
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a moisture-absorbent formed body comprising 1) an amine compound and/or a thermally conductive material, 2) a hygroscopic agent, and 3) a resin component, for removing moisture from within the sealed atmosphere of an organic electroluminescent device, and thereby suppressing the occurrence of dark spots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.