Method for making an electromechanical component on a plane substrate
US7625772B2 · kind B2 · utility
5Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2007 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | May 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/02496
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes. The method comprises at least the following steps in sequence:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.