High power LED package and fabrication method thereof
US7626250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2006 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Nov 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
Abstract
An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.