Suspension system and adjustment mechanism for an integrated chip and method
US7626405B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Jun 18, 2007 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Apr 22, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0466
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is a suspension system and adjustment mechanism for an integrated chip held in a clamping or similar assembly and a related method for same. The suspension system Includes a pressure plate member adapted to fit compatibly within the clamp assembly. A hinge assembly applies and releases pressure through the pressure plate member. The hinge assembly has a first open position where pressure is released and a second closed position where pressure is applied. A spring member between the pressure plate member and the hinge assembly has predetermined travel limits controlling the amount of pressure to be applied. In an exemplary embodiment of the invention disclosed herein the suspension system includes an adjustment mechanism which adjusts to the pressure to a fine degree. The adjustment mechanism includes a housing which applies and releases pressures in response to the turning of a control knob. The control knob is connected to a gear apparatus within the housing which responds to the movement of the control knob by moving the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.