Multi-metal coplanar waveguide
US7626476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2007 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | May 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P3/003
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A coplanar waveguide CPW using multi-layer interconnection CMOS technology is provided. In the CPW including an interlayer insulator disposed on a substrate, metal multilayers disposed on the interlayer insulator, and a ground line-a signal line-a ground line formed of an uppermost metal layer, when a ground line of a lowermost layer is connected to the ground line of the uppermost layer, intermediate metal layers are designed to gradually increase or decrease in width, or to be uneven so as to maximize an area where an ultra-high frequency spreads, thereby minimizing CPW loss and maximizing a slow wave effect. As a result, it is possible to improve performance of an ultra-high frequency circuit and miniaturize the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.