Thermal transfer technique using heat pipes with integral rack rails
US7626820B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2008 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Jun 13, 2028 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0266
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal transfer apparatus for cooling a heat-producing electronic component includes an evaporator disposed over the heat-producing electronic component and thermally coupled to the heat-producing electronic component, a plurality of heat pipes carrying a working fluid therein disposed over the evaporator and thermally coupled to the evaporator, a cold plate thermally coupled to a first end of the plurality of heat pipes, and a condenser thermally coupled to a second end of the plurality of heat pipes. The heat pipes extend over the evaporator such that the first end and the second end of the heat pipes couple to the cold plate and condenser at a location not over the heat-producing electronic component. The cold plate and the condenser are supplied with a coolant from outside the thermal transfer apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.