High density in-package microelectronic amplifier
US7626827B2 · kind B2 · utility
4Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2008 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Sep 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10727
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.