Providing a resistive element between reference plane layers in a circuit board
US7626828B1 · kind B1 · utility
3Cited by
20References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2003 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Jul 31, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes reference plane layers and a dielectric between the reference plane layers. A resistive element is also provided between the reference plane layers to provide a resistive path between the reference plane layers. Optimally, a decoupling capacitor is provided having a first electrode electrically connected to the resistive element, and a second electrode electrically connected to one of the reference plane layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.