Method of evaluating surface deformation
US7627428B2 · kind B2 · utility
1Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2007 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | May 16, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N3/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention generally relates to methods for rapidly calculating the surface displacement that results from an arbitrarily shaped load on the surface of a layered substrate. Some embodiments include sparse direct calculations of surface displacement in combination with interpolation methods for estimating surface displacement at other points. Some embodiments include methods for reducing computer time required for calculating surface displacement caused by an arbitrarily shaped load on a layered surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.