Orbital hole match drilling
US7627940B2 · kind B2 · utility
7Cited by
19References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2005 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jan 13, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/307616
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods are disclosed for producing a hole in a work-piece having first and second layers of material. The first layer of material contains a full-sized hole through the first layer of material. The first layer of material is positioned adjacent the second layer of material. An orbital drill is secured to the first layer of material to position a cutting tool of the drill within the through-hole. During operation, when the cutting tool is used to cut a hole in the second layer of material, the alignment keeps the orbital drill stationary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.