Method of mechanically breaking a scribed workpiece of brittle fracturing material
US7628303B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 22, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Feb 13, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/371
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The method for mechanically breaking a flat workpiece of brittle fracturing material includes scribing spaced-apart parallel scribed lines in respective perpendicular cutting directions on the flat workpiece, especially a flat glass plate, with a laser and, after that, mechanically breaking the flat workpiece along the laser-scribed lines. In this way the flat workpiece can be divided into smaller rectangular workpieces. At least one breaking roller is used to break the flat workpiece along the scribed lines in one cutting direction. To improve the break edge quality and provide a higher yield a breaking bar that is shorter than the smaller of the width and the length of the flat workpiece is used to break the flat workpiece along the scribed lines in the other cutting direction and the breaking bar is pressed against each of those scribed lines in successive overlapping steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.