Methods for the deposition of conductive electronic features

US7629017B2 · kind B2 · utility

Assignee

• Cabot Corporation · US

Inventors

• Toivo T. Kodas · Albuquerque, US
• Mark J. Hampden-Smith · Albuquerque, US
• Karel Vanheusden · Albuquerque, US
• Hugh Denham · Albuquerque, US
• Aaron D. Stump · Albuquerque, US
• Allen B. Schult · Albuquerque, US
• Paolina Atanassova · Waltham, US
• Klaus Kunze · Albuquerque, US

Key dates

• Filing date: Oct 4, 2002
• Grant date: Dec 8, 2009
• Expiry date: Oct 14, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/105
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes copper metal for the formation of highly conductive copper features.