Thermally controlled fluidic self-assembly
US7629026B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2004 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jun 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses are provided for assembling a structure on a support having a pattern of binding sites. In accordance with the method, a first fluid is provided on the surface of the support with the first fluid being of a type that that increases viscosity when heated, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. The first fluid proximate to selected binding sites is heated to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.